Program Management - Principal / Sr. Principal Technical Program Manager β IP, ASIC & Chiplet Platforms
Eliyan is building the interconnect technology that makes chiplet-based systems possible.
24 live vacancies in the US.
Eliyan is building the interconnect technology that makes chiplet-based systems possible.
Join the leading chiplet startup!
Eliyan is building NuLink, a proprietary die-to-die chiplet interconnect fabric purpose-built for AI infrastructure at hyperscale.
Eliyan is building NuLink, a proprietary die-to-die chiplet interconnect fabric purpose-built for AI infrastructure at hyperscale.
Join the leading chiplet startup!
Lint / CDC / Synthesis Quality -- AI-Augmented Design Flows - CI/CD for RTL On-Site Monday-Friday - Bay Area, CA / Vancouver, BC / Toronto, ON Full-Time - Equity Participation - Comprehensive Benefits ABOUT THE ROLE Eliyan is the chipletβ¦
You will lead DRC, LVS, and DFM sign-off at chip top level, drive hierarchical verification strategies, and own bump planning and package-level DRC across Intel, TSMC, Samsung, and GlobalFoundries technologies spanning 28nm through 2nm.
You will define and deploy multi-vendor, multi-foundry design methodology platforms, lead hierarchical SoC implementation strategies, and drive low-power chiplet products.
Join the leading chiplet startup!
Join the leading chiplet startup!
Eliyan is building NuLink, a proprietary die-to-die chiplet interconnect fabric purpose-built for AI infrastructure at hyperscale.
Join the leading chiplet startup!
Join the leading chiplet startup!
Join the leading chiplet startup!
Join the leading chiplet startup!
Join the leading chiplet startup!
Join the leading chiplet startup!
Join the leading chiplet startup!
Join the leading chiplet startup!
Join the leading chiplet interconnect startup! We are seeking an experienced Senior/Staff Packaging Engineer specializing in electro-thermal simulation to join our advanced packaging team.